Features #

• SMD\-20 package with 1\.1 mm pitch

• 6 PWM outputs

• Brightness $dutycycle$ adjustable from 5% to 100%

• Factory default duty cycle: 50% for both cool and warm channels

• Built\-in night light function

• Wall switch\-controlled color temperature adjustment

Applications #

• Smart LED lighting and smart home systems

• Low\-power smart sensors

• Intelligent building automation

• Smart home appliances

• Smart sockets and smart lighting

• Industrial wireless control

• Baby monitors

• Smart public transportation systems

Physical Dimensions #

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Pin Definition #

The TB\-04 module provides a total of 20 pins\. The pinout is shown in the figure below, and the table lists the corresponding functions for each pin\.

TB\-04 Pinout Diagram

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Pin Function Definition Table

Key Specifications #

Table 1 Key Parameter Description

Absolute Maximum Ratings #

Exposure to conditions beyond the following absolute maximum ratings may cause permanent damage to the TLSR8258\.

Recommended Operating Conditions #

Power Consumption in Operating Modes #

Basic RF Characteristics #

RF Transmit Power #

RF Receive Sensitivity #

Antenna Type #

The BTU module uses an on\-board PCB antenna with an antenna gain of 1\.1 dBi\.

Antenna Interference Mitigation #

To ensure optimal RF performance, it is recommended to maintain a minimum clearance of 15 mm between the module antenna and any metal objects\.

If the antenna is surrounded by metal materials in the application environment, the wireless signal may be significantly attenuated, resulting in degraded RF performance\.

During product design, sufficient clearance should be reserved around the antenna area to ensure optimal wireless communication performance\.

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Mechanical Dimensions #

• PCB Size: 20\.3 ± 0\.35 mm $L$ × 15\.8 ± 0\.35 mm $W$ × 1\.0 ± 0\.1 mm $H$

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Side View #

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PCB Footprint $SMT$ #

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Application Circuit #

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Antenna Layout Requirements #

Place the module at the edge of the main PCB\. Do not place any metal objects near the antenna area, and keep the antenna away from high\-frequency components\.

Power Supply #

$1$ A 3\.3 V power supply is recommended, with a peak current capability of at least 50 mA\.

$2$ An LDO regulator is recommended\. If a DC\-DC converter is used, it is recommended to keep the output ripple voltage below 30 mV\.

$3$ For DC\-DC power supply designs, it is recommended to reserve space for dynamic response capacitors to optimize output ripple performance when significant load variations occur\.

$4$ It is recommended to add ESD protection devices to the 3\.3 V power supply input\.

PWM Dimming Design Guidelines #

For lighting applications requiring dimming functionality, simply connect the PWM pin corresponding to the desired color channel to the control input of the downstream driver circuit\. The PWM output provides an independently controlled digital signal with 100 levels of adjustable duty cycle\. The downstream circuit may be either voltage\-driven or current\-driven\.

Connection Diagram

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LED Driver Reference Design #

The TB\-04 module requires only a 3\.3 V power supply and a simple driver circuit to implement intelligent lighting control\. Taking a single cool\-white LED channel driven by a MOSFET as an example, the reference design is shown in the figure below\.

CW\_I is the PWM output pin for the cool\-white channel of the module, Q1 is the MOSFET, and WW represents the LED\. The other four LED driver channels can be designed using the same approach as this channel\.

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Reflow Soldering Profile #

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Assembly Method #

For factory\-supplied SMD\-packaged modules, it is recommended to use SMT machines for placement\. After opening the packaging, soldering should be completed within 24 hours\.

If the modules are not used completely after opening, they should be stored in a dry cabinet with humidity not exceeding 10% RH, or re\-packaged in vacuum and the exposure time should be recorded\. The total exposure time should not exceed 168 hours\.

Equipment required for SMT assembly:

• Pick\-and\-place machine

• SPI $SolderPasteInspection$

• Reflow oven

• Temperature profiler

• AOI $AutomatedOpticalInspection$

Equipment required for baking:

• Cabinet oven for baking

• Anti\-static, high\-temperature resistant trays

• Anti\-static, high\-temperature resistant gloves

Storage Conditions for Factory\-Supplied Modules #

• Moisture\-proof bags must be stored at temperatures below 40°C and relative humidity below 90% RH\.

• For dry\-packaged products, the shelf life is 12 months from the date of sealing\.

• Humidity indicator cards are included inside the sealed packaging\.

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Modules Must Be Baked If Moisture Exposure Is Suspected Under Any of the Following Conditions #

• The vacuum package is found to be damaged before opening\.

• No humidity indicator card is found inside the package after opening\.

• After opening, the humidity indicator card shows that the 10% RH indicator $orhigher$ has changed to pink\.

• The total exposure time after opening exceeds 168 hours\.

• More than 12 months have elapsed since the date of the original sealed packaging\.

Baking Parameters #

• Baking Temperature:

  Reel packaging: 40°C, humidity ≤ 5% RH

  Tray packaging: 125°C, humidity ≤ 5% RH $high\text{-}temperature\text{-}resistanttraysonly;plasticblistertraysarenotsuitable$

• Baking Time:

  Reel packaging: 168 hours

  Tray packaging: 12 hours

• Alarm Temperature Setting:

  Reel packaging: 50°C

  Tray packaging: 135°C

• After baking, allow the modules to cool naturally to below 36°C before production\.

• If the modules remain unused for more than 168 hours after baking, they should be baked again before use\.

• If the exposure time exceeds 168 hours without baking, reflow soldering is not recommended for this batch of modules\. As the module is classified as an MSL 3 $MoistureSensitivityLevel3$ device, exceeding the allowable exposure time may result in moisture absorption\. High\-temperature soldering under such conditions may cause device failure or poor soldering quality\.

ESD Protection #

During the entire manufacturing process, appropriate Electrostatic Discharge $ESD$ protection measures must be implemented for the modules\.

Quality Control Recommendations #

To ensure a high production yield, it is recommended to use SPI and AOI inspection equipment to monitor solder paste printing quality and component placement quality\.

   

Recommended Reflow Profile #

Please configure the reflow oven temperature settings according to the recommended reflow soldering profile\. The peak temperature should be 245°C\. The recommended reflow temperature profile is shown in the figure below\.

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Note: The recommended reflow profile above is based on SAC305 solder paste\. For other solder paste alloys, please configure the reflow oven temperature profile according to the recommendations provided in the corresponding solder paste datasheet\.

ESD Protection #

During the entire manufacturing process, appropriate Electrostatic Discharge $ESD$ protection measures must be implemented for the modules\.

Quality Control Recommendations #

To ensure a high production yield, it is recommended to use SPI and AOI inspection equipment to monitor solder paste printing quality and component placement quality\.